AMAOE MI12 0.12mm BGA Reballing Stencil for Xiaomi Mi 10/Mi 10 Pro Redmi K30 Pro Snapdragon 865

Name: AMAOE MI12 0.12mm BGA Reballing Stencil for Xiaomi Mi 10/Mi 10 Pro Redmi K30 Pro Snapdragon 865
Brand: AMAOE
SKU: MI-12
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-12

Availability: In Stock

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Tags: MI12 Stencil BGA Reballing CPU Stencil

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Product Description

AMAOE MI12 is a 0.12mm BGA reballing stencil designed for Snapdragon 865 (SM8250) CPU reballing and motherboard repair. It is suitable for compatible Xiaomi and Redmi devices, including Xiaomi Mi 10, Mi 10 Pro and Redmi K30 Pro.

The stencil provides a precise solder-ball pattern for reballing compatible CPU chips during mobile motherboard repair. Its 0.12mm thickness is intended for professional BGA rework and microsoldering applications.

Brand	AMAOE
Model	MI12
Thickness	0.12mm
Type	CPU BGA Reballing Stencil
CPU	Qualcomm Snapdragon 865 (SM8250)
Compatible Devices	Xiaomi Mi 10, Xiaomi Mi 10 Pro, Redmi K30 Pro
Application	CPU BGA Reballing and Mobile Motherboard Repair
Package	1 × Stencil

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